Solder resist　formation:

• -FC-BGA substrates/FC-CSP substrates
• -Various module substrates such as AiP
• -HDI substrates

-Exposure of various other sensitive materials

• -Photovia, coverlay, etc.

• Realizes resist SRO of φ40µm to accommodate miniaturization of package substrates. (EDi-5308)
• New UV lamp light source with greatly improved light intensity achieves up to 10% higher productivity than conventional models. (EDi-8308)
• The broadband wavelength of the UV lamp light source enables the use of a wide range of photo sensitive materials.
• High positional accuracy of 6 µm is achieved with the D-A-T high-precision compensation technology and a new high-precision stage (EDi-5308).
• Die by Die alignment function solves the die shift problem of FO-PLP (optional function)
• Supports large substrates up to 25 "X32" (EDi-8310)