Package Substrate Insulation Via Formation.

Circuit formation by trenching.

• High microfabrication performance, capable of Φ5μm vias.
• Various shapes, including large and small vias and rectangles, can be simultaneously handled by mask design.
• Productivity is constant regardless of the number of vias, and the units can handle future increases in the number of vias.
• Bump pitch of 40µm or less is possible due to its fine via processing performance and high-precision alignment performance.