露光装置：Mmsシリーズ
bg mms-series 02
title 01
  • Solder resist Imaging/circuit patterning on various substrates (HDI boards, flexible boards, module boards, etc).
  • Development of various materials, prototyping, etc.
title 01
  • Broadband wavelengths enable the use of a wide variety of solder resists, such as white and black.
  • Supports a wide range of needs, from small-lot, multi-variety prototyping and production to mass production with retrofitting to conveyor systems.
  • Optical head configuration can be proposed according to substrate size and budget.
  • Large-format models are also available.
  
Exposure Imagng

Exposure Imagng

Conventional Solder Resist

 

Conventional Solder Resist(Black)

 

Dry film type solder resist

 

Conventional dry film(high resolution type)

 

Conventional dry film

 

Highly sensitive dry film

 
Product specification

Product specification

 Light sourceResolutionMaximum exposure sizeThicknessTotal Overlay Accuracy
Mms508D UV Lamp SRO: Φ 40μm (DFR:10μm L/S) 635 x 535 mm 0.04 ~ 2.4 mm 6 μm
Mms808D UV Lamp SRO: Φ 80μm (DFR:30μm L/S) 635 x 535 mm 0.04 ~ 2.4 mm 7 μm
Mms810D UV Lamp SRO: Φ 80μm (DFR:30μm L/S) 813 x 635 mm 0.04 ~ 2.4 mm
 2.4 ~ 8.0 mm (Board cannot be held down)		 7 μm

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