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Supports a wide variety of applications.Compatible with 6/8/12 inch lithography for WL-CSP, IGBT, CIS, etc. |
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Video
Video
Repeat product videos for related systems
Product specification
Product specification
| Model type | PPS-8200p1/8300p1 |
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| Wafer Size | 6/8/12 inches |
| Resolution | 2.0 µmL/S (2.0 µm resist thickness) |
| NA (numerical aperture) | 0.16, 0.1 variable |
| Reduction ratio | 1:1 |
| Field Size | 52mm × 33mm |
| Exposure wavelength | ghi-line gh-line i-line (recipe linked) |
| Reticle Size | 6inch |
| Total Overlay Accuracy | ≦0.5 µm(|Ave|+3σ) |
| System Size/Weight | （W）2,260×（D）3,460×（H）2,500mm / 5,500kg |
| Main Options | Backside Alignment System Wafer Peripheral Exposure System Wafer peripheral non-exposure system Thin wafer transfer system GEM communication support Inline support |
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